Сегодня в рассылке три книги по компаундам и заливке.
📕Haleh Ardebili, Michael Pecht - Encapsulation Technologies for Electronic Applications (Materials and Processes for Electronic Applications) (2009)
📗M.O. Alam, Christopher Bailey - Advanced Adhesives in Electronics_ Materials, properties and applications-Woodhead Publishing (2011)
📘(Materials and Processes for Electronic Applications) James J. Licari, Dale W. Swanson - Adhesives Technology for Electronic Applications_ Materials, Processing, Reliability-William Andrew (2011)
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#DFR #compaund #material #book